TEST SERIES 
Date : 17 Jan 2022
​Design Linked Incentive (DLI) Scheme from domestic semiconductor chip design firms
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- With an overall vision to create a vibrant ecosystem for Semiconductor Chip Design in the country, the Ministry of Electronics and Information (MeitY) is seeking applications from 100 domestic companies, start-ups and MSMEs under its Design Linked Incentive (DLI) Scheme.
- Under the DLI Scheme, which was announced by MeitY in December, financial incentives and design infrastructure support will be extended to domestic companies, startups and MSMEs across various stages of development and deployment of semiconductor design for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor linked design for over a period of 5 years.
- The scheme, which was a part of Rs. 76,000 crore ($10 billion) package that the government announced in December 2021, aims to nurture at least 20 domestic companies involved in semiconductor design and facilitating them to achieve turnover of more than Rs, 1500 Crore in the next 5 years.
- C-DAC (Centre for Development of Advanced Computing), a scientific society operating under MeitY, will serve as the nodal agency for implementation of the DLI scheme.
- The scheme has three components –
- Chip Design infrastructure support,
- Product Design Linked Incentive and
- Deployment Linked Incentive.
- Under the Chip Design infrastructure support, C-DAC will setup the India Chip Centre to host the state-of-the-art design infrastructure (viz. EDA Tools, IP Cores and support for MPW (Multi Project Wafer fabrication) & post-silicon validation) and facilitate its access to supported companies.
- Under the Product Design Linked Incentive component, a reimbursement of up to 50% of the eligible expenditure subject to a ceiling of Rs. 15 Crore per application will be provided as fiscal support to the approved applicants who are engaged in semiconductor design.
